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          深圳誠暄多層線路板有限公司是一家專業生產多層線路板廠家,提供高精密多層電路板快速打樣及生產制作服務,價格優惠,歡迎咨詢。

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          高頻板、HDI板、埋盲孔板、厚銅板、高TG板、混壓板

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          181-1873-4090

          當前位置:多層線路板 > 新聞動態 > 常見問題 >

          印制電路板的IPC標準目錄(三)

          文章出處:誠暄PCB 人氣:作者:小編 發表時間:2020-03-05 17:16:53

            采用高速技術電子封裝設計導則

            IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design

            控制阻抗電路板與高速邏輯設計

            IPC-D-316 High Frequency Design Guide

            高頻設計指南

            IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications

            高速高頻用基材規范

            IPC-6018A Microwave End Product Board Inspection and Test

            微波成品印制板的檢驗和測試

            IPC-FC-231C Flexible Base Dielectrics for Use in Flexible Printed Wiring

            撓性印制線路用撓性絕緣基底材料

            IPC-FC-232C Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonded Films

            撓性印制線路覆蓋層用涂粘接劑絕緣薄膜

            IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards

            印制線路板復合金屬材料規范

            IPC-FC-241C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring

            制造撓性印制線路板用撓性覆箔絕緣材料

            IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)

            撓性印制板的鑒定與性能規范(包括修改單1)

            IEC/PAS 62249 Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)

            撓性印制板的鑒定與性能規范(包括修改單1)

            IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

            IPC/JPCA單雙面撓性印制板性能手冊

            IEC/PAS 62123 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

            單雙面撓性印制板性能手冊

            IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits

            單面和雙面撓性電路組裝導則

            IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards

            剛性及多層印制板用基材規范

            IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test

            薄層壓板尺寸穩走性試----國際聯合試驗計劃I階段及II階段報告

            IPC-TA-720 Technology Assessment Handbook on Laminates

            層壓板技術精選[1]手冊

            IPC-4562 Metal Foil for Printed Wiring Applications

            印制線路用金屬箔

            IPC-CF-148A Resin Coated Metal for Printed Boards

            印制板用涂樹脂金屬箔

            IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards

            印制線路板復合金屬材料規范

            IPC-TR-482 New Developments in Thin Copper Foils

            薄銅箔的新發展

            IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study

            IPC銅箔延展性聯合研究結果

            IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study

            銅箔斷裂強度試驗聯合研究結果

            IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

            多層印制板用芯板結構選擇導則

            IPC-EG-140 Specification for Finished Fabric Woven form "E" Glass for Printed Boards

            印制板用經處理E玻璃纖維編織物規范

            IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards

            印制板用經處理S玻璃纖維織物規范

            IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Materials

            E 玻璃非織布規范及性能確定方法

            IEC/PAS 62212 Specification & Characterization Methods for Nonwoven "E" Glass Materials E 玻璃非織布規范及性能確定方法

            IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

            印制板用經處理石英(熔融純氧化硅)纖維編織物規范

            IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards

            印制板用纖維紙規范及性能確定方法

            IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards

            印制板用經處理聚芳酰胺纖維編織物規范

            IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1

            聚芳基酰胺非織布規范及性能確定方法, 包括修改單 1

            IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1

            關于聚芳基酰胺非織布規范及性能確定方法的修改單 1

            IEC/PAS 62213 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, without Amendment 1

            聚芳基酰胺非織布規范及性能確定方法, 不包括修改單 1

            IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation

            內層分離的互連應力測試(IST)與顯微剖切相關性聯合研究

            IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

            未組裝印制板電測試要求和指南

            IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC)

            實施統計過程控制(SPC)的通用導則

            IPC-TR-549 Measles in Printed Wiring Boards

            印制線路板的白斑

            IPC-MS-810 Guidelines for High Volume Microsection

            大批量顯微剖切導則

            IPC-OI-645 Standard for Visual Optical Inspection Aids

            目視光學檢查工具標準

            IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials

            印制板、元器件及材料檢驗試驗設備的認證

            IPC-2524 PWB Fabrication Data Quality Rating System

            印制板制造數據質量定級體系

            IT-97061 PWB Hole to Land Misregistration: Causes and Reliability

            印制線路板通孔與焊盤的錯位: 原因和可靠性

            IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels

            多層板內部無焊盤層互連錯位的可靠性

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