印制電路板的IPC標準目錄(三)
采用高速技術電子封裝設計導則
IPC-2141 Controlled Impedance Circuit Boards & High Speed Logic Design
控制阻抗電路板與高速邏輯設計
IPC-D-316 High Frequency Design Guide
高頻設計指南
IPC-4103 Specification for Base Materials for High Speed/High Frequency Applications
高速高頻用基材規范
IPC-6018A Microwave End Product Board Inspection and Test
微波成品印制板的檢驗和測試
IPC-FC-231C Flexible Base Dielectrics for Use in Flexible Printed Wiring
撓性印制線路用撓性絕緣基底材料
IPC-FC-232C Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonded Films
撓性印制線路覆蓋層用涂粘接劑絕緣薄膜
IPC-FC-234 Composite Metallic Materials Specification for Printed Wiring Boards
印制線路板復合金屬材料規范
IPC-FC-241C Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring
制造撓性印制線路板用撓性覆箔絕緣材料
IPC-6013-K Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)
撓性印制板的鑒定與性能規范(包括修改單1)
IEC/PAS 62249 Qualification & Performance Specification for Flexible Printed Boards (Includes Amendment 1)
撓性印制板的鑒定與性能規范(包括修改單1)
IPC/JPCA-6202 IPC/JPCA Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
IPC/JPCA單雙面撓性印制板性能手冊
IEC/PAS 62123 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards
單雙面撓性印制板性能手冊
IPC-FA-251 Guidelines for Assembly of Single- and Double-Sided Flex Circuits
單面和雙面撓性電路組裝導則
IPC-4101A Specifications for Base Materials for Rigid and Multilayer Printed Boards
剛性及多層印制板用基材規范
IPC-TR-483 Dimensional Stability Testing of Thin Laminates-Report on Phase 1 & 2 International Round Robin Test
薄層壓板尺寸穩走性試----國際聯合試驗計劃I階段及II階段報告
IPC-TA-720 Technology Assessment Handbook on Laminates
層壓板技術精選[1]手冊
IPC-4562 Metal Foil for Printed Wiring Applications
印制線路用金屬箔
IPC-CF-148A Resin Coated Metal for Printed Boards
印制板用涂樹脂金屬箔
IPC-CF-152B Composite Metallic Materials Specification for Printed Wiring Boards
印制線路板復合金屬材料規范
IPC-TR-482 New Developments in Thin Copper Foils
薄銅箔的新發展
IPC-TR-484 Results of IPC Copper Foil Ductility Round Robin Study
IPC銅箔延展性聯合研究結果
IPC-TR-485 Results of Copper Foil Rupture Strength Test Round Robin Study
銅箔斷裂強度試驗聯合研究結果
IPC-4121 Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications
多層印制板用芯板結構選擇導則
IPC-EG-140 Specification for Finished Fabric Woven form "E" Glass for Printed Boards
印制板用經處理E玻璃纖維編織物規范
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards
印制板用經處理S玻璃纖維織物規范
IPC-4130 Specification & Characterization Methods for Nonwoven "E" Glass Materials
E 玻璃非織布規范及性能確定方法
IEC/PAS 62212 Specification & Characterization Methods for Nonwoven "E" Glass Materials E 玻璃非織布規范及性能確定方法
IPC-QF-143 Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards
印制板用經處理石英(熔融純氧化硅)纖維編織物規范
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards
印制板用纖維紙規范及性能確定方法
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards
印制板用經處理聚芳酰胺纖維編織物規范
IPC-4411-K Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, with Amendment 1
聚芳基酰胺非織布規范及性能確定方法, 包括修改單 1
IPC-4411-AM1 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, Amendment 1
關于聚芳基酰胺非織布規范及性能確定方法的修改單 1
IEC/PAS 62213 Specification and Characterization Methods for Non-Woven Para-Aramid Reinforcement, without Amendment 1
聚芳基酰胺非織布規范及性能確定方法, 不包括修改單 1
IPC-TR-486 Round Robin Study to Correlate IST & Microsectioning Evaluations for Inner-Layer Separation
內層分離的互連應力測試(IST)與顯微剖切相關性聯合研究
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
未組裝印制板電測試要求和指南
IPC-9191 General Guidelines for Implementation of Statistical Process Control (SPC)
實施統計過程控制(SPC)的通用導則
IPC-TR-549 Measles in Printed Wiring Boards
印制線路板的白斑
IPC-MS-810 Guidelines for High Volume Microsection
大批量顯微剖切導則
IPC-OI-645 Standard for Visual Optical Inspection Aids
目視光學檢查工具標準
IPC-QL-653A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
印制板、元器件及材料檢驗試驗設備的認證
IPC-2524 PWB Fabrication Data Quality Rating System
印制板制造數據質量定級體系
IT-97061 PWB Hole to Land Misregistration: Causes and Reliability
印制線路板通孔與焊盤的錯位: 原因和可靠性
IT-98103 Reliability of Misregistered and Landless Innerlayer Interconnects in Thick Panels
多層板內部無焊盤層互連錯位的可靠性