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          深圳誠暄多層線路板有限公司是一家專業生產多層線路板廠家,提供高精密多層電路板快速打樣及生產制作服務,價格優惠,歡迎咨詢。

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          高頻板、HDI板、埋盲孔板、厚銅板、高TG板、混壓板

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          181-1873-4090

          當前位置:多層線路板 > 新聞動態 > 常見問題 >

          印制電路板的IPC標準目錄(一)

          文章出處:誠暄PCB 人氣:作者:小編 發表時間:2020-03-05 17:18:54

            印制電路板(Printed Circuit Boards)

            IPC-6010 Series IPC-6010 Qualification and Performance Series

            IPC-6010印制電路板質量標準和性能規范系列手冊

            IPC-A-600F Acceptability of Printed Boards

            印制板驗收條件

            IPC-6011 Generic Performance Specification for Printed Boards

            印制板通用性能規范

            IEC/PAS 62214 Generic Performance Specification for Printed Boards

            印制板總體性能規范

            IPC-6012A-AM Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

            剛性印制板的鑒定與性能規范 (包括修改單1)

            IEC/PAS 62250 Qualification and Performance Specification for Rigid Printed Boards-Includes Amendment 1

            剛性印制板的鑒定與性能規范

            IPC-6015 Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnections

            有機多芯片模塊(MCM-L)安裝及互連結構的鑒定與性能規范

            IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards

            聚合物厚膜印制板的鑒定與性能

            IPC-QE-605A Printed Board Quality Evaluation Handbook

            印制板質量評價

            IPC-PWB-EVAL-CH Printed Wiring Board Defect Evaluation Chart

            印制線路板瑕疵評價流程圖冊

            IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards

            封入式分立布線互連板通用規范

            IPC-DW-425A Design and End Product Requirements for Discrete Wiring Boards

            印制板分立線路的設計及成品要求(包括修改單1)

            IPC-DW-426 Specification for Assembly of Discrete Wiring 分立線路組裝規范

            IPC-HM-860 Specification for Multilayer Hybrid Circuits 多層混合電路規范

            IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards

            多層互連板熱特性

            IPC-TR-481 Results of Multilayer Tests Program Round Robin

            多層印制板聯合試驗計劃結果

            IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

            用于電子元件安裝與互連的印制板質量評價

            IPC-TR-578 Leading Edge Manufacturing Technology Report

            前沿制造技術報告

            IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in PWBs

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